SOT569-2: TFBGA144 | 恩智浦半导体

SOT569-2: TFBGA144


概述

plastic thin fine-pitch ball grid array package; 144 balls
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
TFBGA144 surface mount bottom TFBGA 12 x 12 x 1.05 144 plastic
生产代码 Reference Codes Issue Date
SOT569 2008-03-14
部分 描述 Quick access
16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface
16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface