SOT549-3: HTSSOP32
概述
plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
| Package Version | Package Name | 贴装 | 端子位置 | 封装风格 | 尺寸 | 終止計數 | 材料 |
|---|---|---|---|---|---|---|---|
| SOT549-3 | HTSSOP32 | surface mount | double | HTSSOP | 32 | plastic |
| 生产代码 | Reference Codes | Issue Date |
|---|---|---|
| SOT549 | MO-153(JEDEC | 2005-11-02 |