SOT537-1: LFBGA114 | 恩智浦半导体

SOT537-1: LFBGA114


概述

plastic, low profile fine-pitch ball grid array package; 114 balls; 0.8 mm pitch; 16 mm x 5.5 mm x 1.5 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
LFBGA114 surface mount bottom LFBGA 16 x 5.5 x 1.5 114 plastic
生产代码 Reference Codes Issue Date
SOT537 2003-02-05