For best experience this site requires Javascript to be enabled. To enable on your browser, follow our
accessibility instructions
.
×
My Account
Orders
Sign Out
En
English
ä¸æ
æ¥æ¬èª
íêµì´
产品信息
封装
封装搜索
SOT532-1: BGA388
SOT532-1: BGA388
概述
plastic, ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body
Package Version
Package Name
贴装
端子位置
封装风格
尺寸
終止計數
材料
SOT532-1
BGA388
surface mount
bottom
BGA
35 x 35 x 1.75
388
plastic
生产代码
Reference Codes
Issue Date
SOT532
MS-034(JEDEC);144E(IEC
2003-01-23