SOT2169-1: HWFLGA36 | 恩智浦半导体

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SOT2169-1: HWFLGA36

概述

HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 4.45 mm x 3.65 mm x 0.63 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT2169-1	HWFLGA36	surface mount	bottom	HWFLGA	4.45 x 3.65 x 0.63	36	plastic

生产代码	Reference Codes	Issue Date
98ASA01859D		2021-12-15