SOT2168-1: HWFLGA60 | 恩智浦半导体

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SOT2168-1: HWFLGA60

概述

HWFLGA60, thermal enhanced very very thin finepitch land grid array package, 0.4 mm pitch, 9.05 mm x 4.05 mm x 0.63 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT2168-1	HWFLGA60	surface mount	bottom	HWFLGA	9.05 x 4.05 x 0.63	60	plastic

生产代码	Reference Codes	Issue Date
98ASA01867D		2022-10-31