SOT2139-1: LFBGA169 | 恩智浦半导体

SOT2139-1: LFBGA169


概述

LFBGA169, low-profile fine-pitch ball grid array package, 169 terminals, 0.65 mm pitch, 9 mm x 9 mm x 1.3 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
LFBGA169 surface mount bottom LFBGA 9 x 9 x 1.3 169 plastic
生产代码 Reference Codes Issue Date
98ASA01774D 2021-04-28
部分 描述 Quick access
M7 core
M7 core
M7 core
M7 core