SOT2098-1: 172 HDQFP_EP  | 恩智浦半导体

SOT2098-1: 172 HDQFP_EP


概述

172 HDQFP_EP, thermally enhanced High Density Quad Flat Package_Exposed Pad, 172 leads, 16 x 16 x 1.65, 0.65 mm pitch
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
172 HDQFP_EP surface mount quad 16 x 16 x 1.65 172 plastic
生产代码 Reference Codes Issue Date
98ASA01667D MO-355 F(JEDEC 2023-08-16
部分 描述 Quick access
8MB Flash, 1152KB RAM, ASIL B, 3xM7 cores @240Mhz, 1Gbps ENET, HSE B, +125C, 172HDQFP-EP
S32K358 Arm Cortex-M7, 240 MHz, 8 MB Flash, CAN FD, HSE B security, 172 HDQFP – S32K MCUs for General Purpose
8MB Flash, 1152KB RAM, ASIL D, 1xM7 LS core @240Mhz, 1Gbps ENET, HSE B, +125C, 172HDQFP-EP
8MB Flash, 1152KB RAM, ASIL B, 2xM7 cores @240Mhz, 1Gbps ENET, HSE B, +125C, 172HDQFP-EP