SOT2069-1: WLCSP141 Wafer Level Chip-size Package | 恩智浦半导体

SOT2069-1: WLCSP141


概述

WLCSP141, wafer level chip scale package, 141 terminals, 0.35 mm pitch, 4.525 mm x 4.525 mm x 0.49 mm body (back side coating included)
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
WLCSP141 surface mount bottom WLCSP 4.525 x 4.525 x 0.49 141
生产代码 Reference Codes Issue Date
98ASA01653D 2020-07-13