SOT2057-1: WLCSP70 Wafer Level Chip-size Package | 恩智浦半导体

SOT2057-1: WLCSP70


概述

WLCSP70, wafer level chip scale package, 70 terminals, 0.4 mm pitch, 4.16 mm x 2.96 mm x 0.525 mm body (backside coating included)
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
WLCSP70 surface mount bottom WLCSP 4.16 x 2.96 x 0.525 70
生产代码 Reference Codes Issue Date
98ASA01576D 2020-05-20