SOT2044-1: HUBGA182

概述

HUBGA182, thermal enhanced ultra thin ball grid array package, 182 terminals, 0.4 mm pitch, 6.1 mm x 6.5 mm x 0.56 mm body

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT2044-1	HUBGA182	surface mount	bottom	HBGA	6.1 x 6.5 x 0.56	182	plastic

生产代码	Reference Codes	Issue Date
98ASA01500D		2019-09-05

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