SOT1530-1: LFBGA369


概述

LFBGA369, plastic, low profile fine-pitch ball grid array; 369 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
LFBGA369 surface mount bottom LFBGA 19 x 19 x 1.61 369 plastic
生产代码 Reference Codes Issue Date
98ASA00199 2017-06-11
部分 描述 Quick access
PowerQUICC, Power Arch SoC, 200MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 133MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 266MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, CAN, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 133MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 266MHz, DDR2, HDLC, TDM, Enet, USB, CAN, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 200MHz, DDR2, HDLC, TDM, Enet, USB, CAN, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 133MHz, DDR2, HDLC, TDM, Enet, USB, CAN, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 200MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, CAN, -40 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 266MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 266MHz, DDR2, HDLC, TDM, Enet, USB, CAN, -40 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 200MHz, DDR2, HDLC, TDM, Enet, USB, CAN, -40 to 105C, Rev 1.1
PowerQUICC, Power Arch SoC, 133MHz, DDR2, HDLC, TDM, Enet, USB, CAN, -40 to 105C, Rev 1.1