SOT1454-1: WLCSP6 Wafer Level Chip-size Package | 恩智浦半导体

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SOT1454-1: WLCSP6

概述

wafer level chip-scale package, 6 bumps

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1454-1	WLCSP6	surface mount	bottom	WLCSP	0.65 x 0.44 x 0.27	6

生产代码	Reference Codes	Issue Date
SOT1454		2016-03-02