SOT1448-2: WLCSP Wafer Level Chip-size Package | 恩智浦半导体

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SOT1448-2: WLCSP

概述

WLCSP29, wafer level chip-scale package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1448-2	WLCSP	surface mount	bottom	WLCSP	3.19 x 2.07 x 0.6	29

生产代码	Reference Codes	Issue Date
SOT1448		2017-01-11