SOT1444-6: WLCSP Wafer Level Chip-size Package | 恩智浦半导体

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SOT1444-6: WLCSP

概述

wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1444-6	WLCSP	surface mount	bottom	WLCSP	2.97 x 3.37 x 0.5	49

生产代码	Reference Codes	Issue Date
SOT1444		2016-04-26