SOT1444-10: WLCSP Wafer Level Chip-size Package | 恩智浦半导体

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SOT1444-10: WLCSP

概述

WLCSP49, wafer level chip-scale package; 49 bumps; 2.97 mm x 3.37 mm x 0.56 mm (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1444-10	WLCSP	surface mount	bottom	WLCSP	2.97 x 3.37 x 0.56	49

生产代码	Reference Codes	Issue Date
SOT1444		2017-01-06