SOT1401-3: WLCSP25 Wafer Level Chip-size Package | 恩智浦半导体

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SOT1401-3: WLCSP25

概述

WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1401-3	WLCSP25	surface mount	bottom	WLCSP	2.555 x 2.525 x 0.368	25

生产代码	Reference Codes	Issue Date
98ASA00848D		2017-05-12