SOT1399-1: WLCSP24 Wafer Level Chip-size Package | 恩智浦半导体

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SOT1399-1: WLCSP24

概述

WLCSP24, wafer level chip-scale package; 24 bumps; 2.98 mm x 1.90 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1399-1	WLCSP24	surface mount	bottom	WLCSP	2.98 x 1.90 x 0.525	24

生产代码	Reference Codes	Issue Date
SOT1399		2017-06-22