SOT1380-6: WLCSP6 Wafer Level Chip-size Package | 恩智浦半导体

SOT1380-6: WLCSP6


概述

WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.18 mm x 0.84 mm x 0.455 mm body (backside coating included)
Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料
WLCSP6 surface mount bottom WLCSP 1.18 x 0.84 x 0.455 6
生产代码 Reference Codes Issue Date
98ASA01666D 2020-12-04