SOT1181-2: HTQFP48

概述

HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOT1181-2	HTQFP48	surface mount	quad	HTQFP	10 x 10 x 1	48	plastic

生产代码	Reference Codes	Issue Date
SOT1181	MS-026(JEDEC	2012-10-23

产品

部分	描述	Quick access
UJA1135HW	Buck HS-CAN/LIN system basis chip	View parametrics
UJA1136HW	Buck HS-CAN/dual LIN system basis chip	View parametrics
UJA1131HW	Buck/boost HS-CAN/LIN system basis chip	View parametrics
UJA1132HW	Buck/boost HS-CAN/dual LIN system basis chip	View parametrics
UJA1132AHW	Buck/boost HS-CAN/dual-LIN system basis chip, 5 V/500 mA + 5 V/100 mA, up to 8 HVIO, optional CAN Partial Networking	View parametrics
UJA1131AHW	Buck/boost HS-CAN/LIN system basis chip, 5 V/500 mA + 5 V/100 mA, up to 8 HVIO, optional CAN Partial Networking	View parametrics
UJA1135AHW	Buck HS-CAN/LIN system basis chip	View parametrics
UJA1136AHW	Buck HS-CAN/dual LIN system basis chip	View parametrics