SOT1172-1: HTSSOP28
概述
plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
| Package Version | Package Name | 贴装 | 端子位置 | 封装风格 | 尺寸 | 終止計數 | 材料 |
|---|---|---|---|---|---|---|---|
| SOT1172-1 | HTSSOP28 | surface mount | double | HTSSOP | 9.7 x 4.4 x 0.9 | 28 | plastic |
| 生产代码 | Reference Codes | Issue Date |
|---|---|---|
| SOT1172 | MO-153(JEDEC | 2010-03-31 |