SOP022-2: LGA350 Land Grid Array Package | 恩智浦半导体

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SOP022-2: LGA350

概述

land grid array package; 350 lands

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
SOP022-2	LGA350	surface mount	bottom	LGA	33 x 33 x 3.4	350	plastic

生产代码	Reference Codes	Issue Date
SOP022		2013-08-02