OL-SA58671UK: WLCSP Uncased Chip | 恩智浦半导体

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OL-SA58671UK: WLCSP

概述

Wafer level chip-size package; 16 balls; 2.06 x 2.11 x 0.6 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-SA58671UK	WLCSP	surface mount	bottom	UC	2.06 x 2.11 x 0.6	16	other

生产代码	Reference Codes	Issue Date
WLCSP16		2007-10-17