OL-PMCM4401UPE: WLCSP Wafer Level Chip-size Package | 恩智浦半导体

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OL-PMCM4401UPE: WLCSP

概述

WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-PMCM4401UPE	WLCSP	surface mount	bottom	WLCSP	0.8 x 0.8 x 0.15	4	other

生产代码	Reference Codes	Issue Date
WLCSP4		2016-06-28