OL-PEMI6CSP_RW: WLCSP Uncased Chip | 恩智浦半导体

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OL-PEMI6CSP_RW: WLCSP

概述

Wafer level chip-size package; 15 bumps (6-3-6)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-PEMI6CSP_RW	WLCSP	surface mount	bottom	UC	2.36 x 1.05 x 0.61	15	other

生产代码	Reference Codes	Issue Date
WLCSP15		2011-07-06