OL-PEMI4CSP_RT: WLCSP Uncased Chip | 恩智浦半导体

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OL-PEMI4CSP_RT: WLCSP

概述

Wafer level chip-size package; 10 bumps (4-2-4)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-PEMI4CSP_RT	WLCSP	surface mount	bottom	UC	1.56 x 1.05 x 0.61	10	other

生产代码	Reference Codes	Issue Date
WLCSP10		2011-07-06