OL-PCA9410: WLCSP
概述
wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included)
| Package Version | Package Name | 贴装 | 端子位置 | 封装风格 | 尺寸 | 終止計數 | 材料 |
|---|---|---|---|---|---|---|---|
| OL-PCA9410 | WLCSP | surface mount | bottom | UC | 1.24 x 1.24 x 0.525 | 9 | plastic |
| 生产代码 | Reference Codes | Issue Date |
|---|---|---|
| OL-PCA9410 | 2015-07-23 |