OL-NXH5104UK: WLCSP Uncased Chip | 恩智浦半导体

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OL-NXH5104UK: WLCSP

概述

wafer level chip-scale package; 13 bumps; 2.74 x 2.80 x 0.38 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-NXH5104UK	WLCSP	surface mount	bottom	UC	2.74 x 2.80 x 0.38	13	plastic

生产代码	Reference Codes	Issue Date
OL-NXH5104UK		2015-10-05