OL-NX5P1100: WLCSP
概述
WLCSP12: wafer level chip-scale package;
12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included)
| Package Version | Package Name | 贴装 | 端子位置 | 封装风格 | 尺寸 | 終止計數 | 材料 |
|---|---|---|---|---|---|---|---|
| OL-NX5P1100 | WLCSP | surface mount | bottom | UC | 1.66 x 1.36 x 0.51 | 12 | other |
| 生产代码 | Reference Codes | Issue Date |
|---|---|---|
| WLCSP12 | 2013-12-20 |