OL-NX3P190: WLCSP Uncased Chip | 恩智浦半导体

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OL-NX3P190: WLCSP

概述

wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-NX3P190	WLCSP	surface mount	bottom	UC	0.76 x 0.76 x 0.51	4	other

生产代码	Reference Codes	Issue Date
WLCSP4	---(EIAJ);---(JEDEC);---(IEC	2011-06-09