OL-NX3P1107UK: WLCSP Uncased Chip | 恩智浦半导体

For best experience this site requires Javascript to be enabled. To enable on your browser, follow our accessibility instructions.

OL-NX3P1107UK: WLCSP

概述

wafer level chip-size package; 4 bumps

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-NX3P1107UK	WLCSP	surface mount	bottom	UC		4	other

生产代码	Reference Codes	Issue Date
WLCSP4	---(EIAJ);---(JEDEC);---(IEC	2012-07-02