OL-NX20P3000UK: WLCSP Uncased Chip | 恩智浦半导体

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OL-NX20P3000UK: WLCSP

概述

wafer level chip-size package; 16 bumps

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-NX20P3000UK	WLCSP	surface mount	bottom	UC	1.96 x 1.96 x 0.54	16	other

生产代码	Reference Codes	Issue Date
WLCSP16	---(EIAJ);---(JEDEC);---(IEC	2011-11-04