OL-IP4852CX25: WLCSP Uncased Chip | 恩智浦半导体

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OL-IP4852CX25: WLCSP

概述

Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4852CX25	WLCSP	surface mount	bottom	UC	2.01 x 2.01 x 0.66	25	other

生产代码	Reference Codes	Issue Date
WLCSP25		2006-09-23