OL-IP4352CX24: WLCSP Uncased Chip | 恩智浦半导体

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OL-IP4352CX24: WLCSP

概述

Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4352CX24	WLCSP	surface mount	bottom	UC	2.01 x 2.02 x 0.61	24	other

生产代码	Reference Codes	Issue Date
WLCSP24		2009-07-06