OL-IP4332CX5: WLCSP Wafer Level Chip-size Package | 恩智浦半导体

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OL-IP4332CX5: WLCSP

概述

Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4332CX5	WLCSP	surface mount	bottom	WLCSP	0.76 x 1.06 x 0.66	5	other

生产代码	Reference Codes	Issue Date
WLCSP5		2011-04-28