OL-IP4309CX9: WLCSP Uncased Chip | 恩智浦半导体

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OL-IP4309CX9: WLCSP

概述

Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4309CX9	WLCSP	surface mount	bottom	UC	1.16 x 1.16 x 0.66	9	other

生产代码	Reference Codes	Issue Date
WLCSP9		2008-09-24