OL-IP4302CX2: WLCSP Uncased Chip | 恩智浦半导体

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OL-IP4302CX2: WLCSP

概述

Wafer level chip-size package; 2 bumps; 0.52 x 0.72 x 0.42 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4302CX2	WLCSP	surface mount	bottom	UC	0.52 x 0.72 x 0.42	2	other

生产代码	Reference Codes	Issue Date
WLCSP2		2008-05-20