OL-IP4080CX20: WLCSP Wafer Level Chip-size Package | 恩智浦半导体

For best experience this site requires Javascript to be enabled. To enable on your browser, follow our accessibility instructions.

OL-IP4080CX20: WLCSP

概述

Wafer level chip-size package; 20 bumps; 2.51 x 2.01 x 0.70 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4080CX20	WLCSP	surface mount	bottom	WLCSP	2.51 x 2.01 x 0.70	20	other

生产代码	Reference Codes	Issue Date
WLCSP20		2008-11-11