OL-IP4060CX16: WLCSP Uncased Chip | 恩智浦半导体

For best experience this site requires Javascript to be enabled. To enable on your browser, follow our accessibility instructions.

OL-IP4060CX16: WLCSP

概述

wafer level chip-size package; 16 bumps

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4060CX16	WLCSP	surface mount	bottom	UC	1.96 x 1.97 x 0.7	16	other

生产代码	Reference Codes	Issue Date
WLCSP16		2009-03-12