OL-IP4052CX20: WLCSP Uncased Chip | 恩智浦半导体

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OL-IP4052CX20: WLCSP

概述

Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP4052CX20	WLCSP	surface mount	bottom	UC		20	other

生产代码	Reference Codes	Issue Date
WLCSP20		2008-11-11