OL-IP3053CX5: WLCSP Uncased Chip | 恩智浦半导体

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OL-IP3053CX5: WLCSP

概述

Wafer level chip-size package; 5 bumps (2-1-2)

Package Version	Package Name	贴装	端子位置	封装风格	尺寸	終止計數	材料
OL-IP3053CX5	WLCSP	surface mount	bottom	UC	0.96 x 1.28 x 0.65	5	other

生产代码	Reference Codes	Issue Date
WLCSP5	---(EIAJ);---(JEDEC);---(IEC	2011-06-06