NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
P1016NXN5BFB
Package Description:
TEPBGA 561 23SQ 2.3 0.8
Tracking Number:
K00073D053
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant
RoHS CoA
Epoxy Die Attach
RoHS CoA
Organic Substrate, Halogen-free
AUS 308
RoHS CoA
E679FGB
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Pb Free, Sn/Ag
RoHS CoA
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