NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MC33772BSP1AE
Package Description:
LQFP 48 7*7*1.4 P0.5 EP
Tracking Number:
K00147D045
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, Copper
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Epoxy Die Attach
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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