AFSC5G26E38T2

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

European RoHS

Chinese RoHS

NXP Semiconductors
Product content declaration of AFSC5G26E38T2		Last Revision (GMT): Friday, 07 June 2024, 12:41:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G26E38T2	SOT1831	HLLGA27	167.175682 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Not Applicable	Other	Not Applicable	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 902 44528	2023-11-24	12	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.475185	99.990000	0.284243
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000048	0.010000	0.000028
			Subtotal		0.475232	100.0000000	0.284271

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.014361
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002872
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.005744
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.034466
			Subtotal		0.096030	100.0000000	0.057443
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002388
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.002390
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003582
			Subtotal		0.005994	100.0000000	0.003586
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000718
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.032298
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002871
			Subtotal		0.059994	100.0000000	0.035887
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000008
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008358
			Subtotal		0.013986	100.0000000	0.008366

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.014361
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002872
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.005744
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.034466
			Subtotal		0.096030	100.0000000	0.057443
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002388
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.002390
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003582
			Subtotal		0.005994	100.0000000	0.003586
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000718
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.032298
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002871
			Subtotal		0.059994	100.0000000	0.035887
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000008
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008358
			Subtotal		0.013986	100.0000000	0.008366

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.032002
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006400
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.012801
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.076805
			Subtotal		0.214000	100.0000000	0.128009
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005383
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.009000	100.0000000	0.005384
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004187
			Subtotal		0.007000	100.0000000	0.004187
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.000957
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.043068
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.003828
			Subtotal		0.080000	100.0000000	0.047854
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.011962
			Subtotal		0.020000	100.0000000	0.011964

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.014361
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002872
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.009603	10.000000	0.005744
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.034466
			Subtotal		0.096030	100.0000000	0.057443
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002388
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.002390
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003582
			Subtotal		0.005994	100.0000000	0.003586
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.053995	90.000000	0.032298
		Copper and its compounds	Copper, metal	7440-50-8	0.001200	2.000000	0.000718
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002871
			Subtotal		0.059994	100.0000000	0.035887
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000014	0.100000	0.000008
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008358
			Subtotal		0.013986	100.0000000	0.008366

Capacitor 5	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.078959
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.013160
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.039479
			Subtotal		0.220000	100.0000000	0.131598
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.004785
			Subtotal		0.008000	100.0000000	0.004785
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004187
			Subtotal		0.007000	100.0000000	0.004187
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.000909
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.040915
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.003637
			Subtotal		0.076000	100.0000000	0.045461
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.011364
			Subtotal		0.019000	100.0000000	0.011365

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.032002
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006400
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.012801
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.076805
			Subtotal		0.214000	100.0000000	0.128009
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005383
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.009000	100.0000000	0.005384
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004187
			Subtotal		0.007000	100.0000000	0.004187
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.000957
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.043068
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.003828
			Subtotal		0.080000	100.0000000	0.047854
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.011962
			Subtotal		0.020000	100.0000000	0.011964

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		5.710600	5.000000	3.415927
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	99.364440	87.000000	59.437137
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	3.426360	3.000000	2.049557
		Inorganic compounds	Carbon Black	1333-86-4	0.571060	0.500000	0.341593
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.114212	0.100000	0.068319
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.484756	1.300000	0.888141
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		3.426360	3.000000	2.049557
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.114212	0.100000	0.068319
			Subtotal		114.212000	100.0000000	68.318549

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.031836	3.061200	0.019044
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.031836	3.061200	0.019044
		Silver and its compounds	Silver, metal	7440-22-4	0.976327	93.877600	0.584013
			Subtotal		1.040000	100.0000000	0.622100

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095456	40.000000	0.057099
		Boron and its compounds	Boron oxide	1303-86-2	0.023864	10.000000	0.014275
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.119320	50.000000	0.071374
			Subtotal		0.238641	100.0000000	0.142748
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000048	0.100000	0.000029
		Silver and its compounds	Silver, metal	7440-22-4	0.047678	99.900000	0.028520
			Subtotal		0.047726	100.0000000	0.028548
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006357	99.900000	0.003802
			Subtotal		0.006363	100.0000000	0.003806
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000032	0.100000	0.000019
		Silver and its compounds	Silver, metal	7440-22-4	0.031787	99.900000	0.019014
			Subtotal		0.031818	100.0000000	0.019033
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000795	5.000000	0.000476
		Boron and its compounds	Boron oxide	1303-86-2	0.002386	15.000000	0.001427
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000795	5.000000	0.000476
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011135	70.000000	0.006661
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000795	5.000000	0.000476
			Subtotal		0.015908	100.0000000	0.009515
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000006
		Tin and its compounds	Tin, metal	7440-31-5	0.009535	99.900000	0.005704
			Subtotal		0.009544	100.0000000	0.005709

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.024630
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.006158
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.030788
			Subtotal		0.102940	100.0000000	0.061576
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.012314
			Subtotal		0.020589	100.0000000	0.012316
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.004063
			Subtotal		0.006794	100.0000000	0.004064
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.016624
			Subtotal		0.027793	100.0000000	0.016625
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000234
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000702
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000234
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.003277
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000234
			Subtotal		0.007826	100.0000000	0.004681
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.005418
			Subtotal		0.009058	100.0000000	0.005418

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.024630
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.006158
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.030788
			Subtotal		0.102940	100.0000000	0.061576
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.012314
			Subtotal		0.020589	100.0000000	0.012316
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.004063
			Subtotal		0.006794	100.0000000	0.004064
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.016624
			Subtotal		0.027793	100.0000000	0.016625
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000234
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000702
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000234
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.003277
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000234
			Subtotal		0.007826	100.0000000	0.004681
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.005418
			Subtotal		0.009058	100.0000000	0.005418

Inductor 4	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.041173	99.990000	0.024629
			Subtotal		0.041177	100.0000000	0.024631
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.082354	40.000000	0.049262
		Boron and its compounds	Boron oxide	1303-86-2	0.020588	10.000000	0.012315
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.102942	50.000000	0.061577
			Subtotal		0.205884	100.0000000	0.123154
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013586	99.990000	0.008127
			Subtotal		0.013587	100.0000000	0.008127
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.055581	99.990000	0.033247
			Subtotal		0.055587	100.0000000	0.033251
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000782	5.000000	0.000468
		Boron and its compounds	Boron oxide	1303-86-2	0.002347	15.000000	0.001404
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000782	5.000000	0.000468
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010954	70.000000	0.006552
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000782	5.000000	0.000468
			Subtotal		0.015648	100.0000000	0.009361
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018114	99.990000	0.010835
			Subtotal		0.018116	100.0000000	0.010837

Resistor	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.025214	96.100000	0.015083
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000105	0.400000	0.000063
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000394	1.500000	0.000235
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000525	2.000000	0.000314
			Subtotal		0.026238	100.0000000	0.015695
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000082
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000007
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000028
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000481
			Subtotal		0.001000	100.0000000	0.000598
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000027
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000001
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000016
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000022
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000532
			Subtotal		0.001000	100.0000000	0.000598
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000099
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000026
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000150
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.000324
			Subtotal		0.001000	100.0000000	0.000598
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001856	99.990000	0.001111
			Subtotal		0.001857	100.0000000	0.001111
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000040
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000452
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000101
			Subtotal		0.001000	100.0000000	0.000598
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000078	5.510000	0.000046
		Boron and its compounds	Boron oxide	1303-86-2	0.000013	0.900000	0.000008
		Copper and its compounds	Cupric oxide	1317-38-0	0.000013	0.900000	0.000008
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000275	19.540000	0.000165
		Lead and its compounds	Lead monooxide	1317-36-8	0.000080	5.650000	0.000048
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000025	1.800000	0.000015
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000127	9.020000	0.000076
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000127	9.020000	0.000076
		Silver and its compounds	Silver, metal	7440-22-4	0.000607	43.050000	0.000363
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000040	2.810000	0.000024
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000025	1.800000	0.000015
			Subtotal		0.001410	100.0000000	0.000843
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000209
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000389
			Subtotal		0.001000	100.0000000	0.000598
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.002785	99.990000	0.001666
			Subtotal		0.002786	100.0000000	0.001666

Semiconductor Die 1	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.005550	1.020000	0.003320
		Inorganic Silicon compounds	Silicon	7440-21-3	0.527837	97.000400	0.315738
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.010772	1.979600	0.006444
			Subtotal		0.544160	100.0000000	0.325502

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	2.470272	89.600000	1.477650
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024813	0.900000	0.014842
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013785	0.500000	0.008246
		Silver and its compounds	Silver, metal	7440-22-4	0.008685	0.315000	0.005195
		Tin and its compounds	Tin, metal	7440-31-5	0.239446	8.685000	0.143230
			Subtotal		2.757000	100.0000000	1.649163

Solder Flux	Solder Flux	Copper and its compounds	Copper, metal	7440-50-8	0.015201	2.986400	0.009093
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.013835	2.718100	0.008276
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.063375	12.450900	0.037909
		Silver and its compounds	Silver, metal	7440-22-4	0.021914	4.305300	0.013108
		Tin and its compounds	Tin, metal	7440-31-5	0.394675	77.539300	0.236084
			Subtotal		0.509000	100.0000000	0.304470

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.016305	0.500000	0.009753
		Silver and its compounds	Silver, metal	7440-22-4	0.097830	3.000000	0.058519
		Tin and its compounds	Tin, metal	7440-31-5	3.146865	96.500000	1.882370
			Subtotal		3.261000	100.0000000	1.950643

Substrate	Substrate	Copper and its compounds	Copper, metal	7440-50-8	12.528000	30.000000	7.493913
		Epoxy Resins	Proprietary Material-Other Epoxy resins		12.945600	31.000000	7.743710
		Gold and its compounds	Gold, metal	7440-57-5	0.417600	1.000000	0.249797
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	12.528000	30.000000	7.493913
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		2.088000	5.000000	1.248986
		Nickel and its compounds	Nickel, metal	7440-02-0	1.252800	3.000000	0.749391
			Subtotal		41.760000	100.0000000	24.979710

			Total		167.175682	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G26E38T2 Product content declaration of AFSC5G26E38T2		上次修订 Last Revision (GMT): Friday, 07 June 2024, 12:41:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板 Substrate	基板 Substrate	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G26E38T2		Last Revision (GMT): Friday, 07 June 2024, 12:41:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	ELECTRODE (BA)	Not Available	Not Available	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	ELECTRODE (BA)	Not Available	Not Available	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	ELECTRODE (BA)	Not Available	Not Available	Test Report 18 Jul 2020	Test Report 18 Jul 2020
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
Semiconductor Die 1		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Semiconductor Die 2		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Solder Flux		Test Report 12 Oct 2023	Test Report 12 Oct 2023	Not Available	Not Available
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer