202303023F01 : I.MX31_Auto molding compound change from G770FL to G770SFL
NXP Semiconductors is announcing the successful qualification of molding compound change from G770FL to G770SFL (low alpha) for i.MX31 AUTO 19*19 BGA parts. G770SFL (low alpha) had better performance than G770FL on SER failure rate. Corresponding ZVEI Delta Qualification Matrix ID: SEM-PA-11
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Assembly materials | 08-Apr-2023 | 07-Jul-2023 |
变化的原因
Molding compound change from G770FL to G770SFL (low alpha) will improve SER performance. Molding compound G770FL and G770SFL (low alpha) have same composition. G770SFL (low alpha) molding compound has better control on alpha particle than G770FL
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
MCIMX31CJMN4D (935325483557) |
- | - | - |
|
MCIMX31CVMN4D (935321891557) |
- | - | - |
|
MCIMX31LCVMN4D (935319427557) |
- | - | - |
|
MCIMX31LCVMN4DR2 (935319427518) |
- | - | - |