202103036F01 : TSSOP8 (SOT505-1) Assembly Expansion in ATBK and Manufacturing Alignment
NXP is expanding ATBK assembly capabilities to include the part types in the attached file list. Mold compound and die adhesive materials in the ATBK manufacturing process will use the standard EMC-7470L-Q and QMI519 materials respectively. Additionally ATBK will employ a roughened leadframe as a package quality improvement to reduce delamination. NXP has extensive manufacturing capabilities in the TSSOP8 family and with the critical demand for these products these changes will help with timely deliveries. It should be noted that the package offering utilized here will use a Roughened Leadframe solution. While the benefit of the solution is better adhesion of the mold compound (there have been no relevant customer returns).
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Product markingassembly materialsassembly location | 06-Oct-2021 | 04-Jan-2022 |
变化的原因
Due to increasing demand for SOT505-1 packaged devices NXP is adding the ATBK flow as an alternate source to help provide timely deliveries.
预期的影响
数据表的修订: No impact to existing datasheet
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
PCA85063ATT/AJ (935305541118) |
- | - | - |
|
PCA85073ADP/Q900Z (935384764431) |
- | - | - |
|
PCA8565TS/1,118 (935272132118) |
- | - | - |
|
PCF85063ATT/AJ (935304639118) |
- | - | - |
|
PCF85263ATT/AJ (935304459118) |
- | - | - |
|
PCF85363ATT/AJ (935304751118) |
- | - | - |
|
PCF8563TS/4,118 (935279522118) |
- | - | - |