202002004F01 : SAC57D54H/53M/52L Die Thickness Increase to 280um For The 516MAPBGA 27*27
NXP Semiconductors announces a change in die thickness for the SAC57D54H/ 53M/ 52L Mask Set N87P from the current 179um to 280um.The above change coincides with DeQuMa ID: SEM-PW-03.
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Assembly process | 12-Mar-2020 | 10-Jun-2020 |
变化的原因
Die thickness increase is to improve product quality reliability and C55 product family standardization.
受影响产品的识别
Product identification does not change
预期的影响
No impact on form fit function reliability or quality.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
SAC57D53MCVMO (935318864557) |
- | - | - |
|
SAC57D53MCVMOR (935318864518) |
- | - | - |
|
SAC57D54HCVMO (935313269557) |
- | - | - |
|
SAC57D54HCVMOR (935313269518) |
- | - | - |