201912009F01:i.MXRT106A FAB Site Transfer from SMIC8 to SMICB2
  • 产品更改通知
  • 201912009F01

201912009F01 : i.MXRT106A FAB Site Transfer from SMIC8 to SMICB2

NXP Semiconductors announces the Wafer Fabrication site transfer for i.MXRT106A from the current SMIC8 Shanghai China Wafer Fabrication site to the SMICB2 Beijing China Wafer Fabrication site.Wafer Fabrication site transfer was successfully qualified adhering to NXP specifications.

PCN类型 更改类别 发行日期 生效日期
Final Product Change Notification Wafer fab location 22-Dec-2019 21-Mar-2020

变化的原因

SMIC8 wafer Fabrication site will cease production for 40nm technology and therefore NXP is moving production of i.MXRT106A to internal SMICB2 Wafer Fabrication site.Qualification of SMICB2 Wafer Fabrication site is required for customer supply assurance.

受影响产品的识别

There is no change to orderable part number. NXP will have traceability by ECID

预期的影响

No impact on form fit function reliability or quality.

受影响的部分

零件号/ 12NC 上次购买日期 上次交货日期 备件
MIMXRT106ADVL6A
(935385521557)
- - -
MIMXRT106ADVL6AR
(935385521518)
- - -
MIMXRT106FDVL6A
(935389817557)
- - -
MIMXRT106LDVL6A
(935389818557)
- - -