201911006F01 : i.MXRT1064 Redistribution Layer Addition On Flash Die
NXP Semiconductors announces to add a RDL layer (Redistribution Layer) to separate the probing and wire bond pads on flash die for i.MXRT1064. The original bond pads and RDL pads are going to be on separate locations. Original bond pads are used for wafer test probing while RDL pads are for wire bonding process.
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Wafer fab process | 06-Dec-2019 | 05-Mar-2020 |
变化的原因
This is to separate the probing and wire bond pads on flash die for manufacturing robustness.
受影响产品的识别
Product identification does not change
预期的影响
No impact on form fit function reliability or quality.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
MIMXRT1064CVL5A (935377468557) |
- | - | - |
|
MIMXRT1064DVL6A (935377469557) |
- | - | - |
|
MIMXRT1064DVL6AR (935377469518) |
- | - | - |