201904029F01:20PDIP Assembly Site Transfer to TFME from ATP1
  • 产品更改通知
  • 201904029F01

201904029F01 : 20PDIP Assembly Site Transfer to TFME from ATP1

NXP Semiconductors announces the assembly site transfer for the MC9S08SH8&SH4 PDIP 20 package from the current Amkor Technology Philippines Inc (ATP1) Muntinlupa Philippines assembly facility to TongFu Microelectronics Co. Ltd. Nantong China.The change in assembly site also includes change in mold compound Epoxy wire metal and lead frame. ATP1 and TFME BOM comparison is attached to this notification.Please see attached files for additional details.

PCN类型 更改类别 发行日期 生效日期
Final Product Change Notification Assembly location, Assembly materials 16-May-2019 14-Aug-2019

变化的原因

The Amkor Technology Philippines (ATP1) Muntinlupa Philippines assembly facility will not support PDIP20 package assembly and need to qualify TongFu Microelectronics Co. Ltd. as PDIP20 new assembly site.

受影响产品的识别

Top side marking The assembly site is reflected in the package trace code. The format for the NXP standard trace PDIP20: AWLYYWWZ or ATWLYYWWZ A=Assembly LocationWL=Wafer Lot YYWW=Date Code Z =Assembly Lot Split The marking for ATP1 is A=ZR The marking for TFME is A=XN

预期的影响

No impact on form fit function reliability or quality.

受影响的部分

零件号/ 12NC 上次购买日期 上次交货日期 备件
MC9S08SH4CPJ
(935320241174)
- - -
MC9S08SH4MPJ
(935321017174)
- - -
MC9S08SH8CPJ
(935319115174)
- - -
MC9S08SH8MPJ
(935319118174)
- - -